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Heat Transfer HandbookFrom Wiley-Interscience
Download Ebook Heat Transfer HandbookFrom Wiley-Interscience
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- Chapters contributed by thirty world-renown experts.
- Covers all aspects of heat transfer, including micro-scale and heat transfer in electronic equipment.
- An associated Web site offers computer formulations on thermophysical properties that provide the most up-to-date values.
- Sales Rank: #2947464 in Books
- Published on: 2003-06-30
- Original language: English
- Number of items: 1
- Dimensions: 9.25" h x 2.68" w x 6.28" l, 4.43 pounds
- Binding: Hardcover
- 1496 pages
From the Back Cover
The most thorough and up-to-date coverage of heat transfer concepts and applications
The Heat Transfer Handbook provides succinct hard data, formulas, and specifications for the critical aspects of heat transfer, offering a reliable, hands-on resource for solving day-to-day issues across a variety of applications.
From the basics to the state of the art, this authoritative reference is the complete single-source handbook of need-to-know information in the industry. With today's professionals in mind, thirty world-renowned experts contribute cutting-edge concepts and applications, as well as insights into the current state of the field and the latest technologies. Standout features of the handbook include the most comprehensive coverage available on contact resistance, and well-conceived, timely material on heat transfer in electronic components.
The book includes access to a website containing the NIST Thermodynamic and Transport Properties of Pure Fluids Database: Version 5.1, which provides computer formulations with the most up-to-date values for thermophysical properties of fluids and materials.
For busy engineers and researchers, the Heat Transfer Handbook is the fast and accurate solution to their everyday needs.
About the Author
ADRIAN BEJAN is the J. A. Jones Professor of Mechanical Engineering at Duke University in Durham, North Carolina.
ALLAN D. KRAUS is a retired professor and practicing consulting engineer in Beechwood, Ohio. He is a frequent adjunct to the engineering faculty at The University of Akron in Ohio.
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